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Software and Service. No more manual screening — automatically, the smart system screens the feverish, takes snapshots, locks down the entrance, and issues alerts.

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Your feedback has been successfully submitted. Thank you very much for your time and participation. In order to make the project as easy as possible for you, DFI will closely work with you to learn your design requirements and offer real-time technical support as you develop the solution to reduce your development cost and effort.

Get Started. Thank you for your feedback. Your personal information will be used to respond to this inquiry only. Your name and email address will not be added to any mailing list, and you will not receive email from Intel Corporation unless requested. All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.

Please contact system vendor for more information on specific products or systems. Functionality, performance, and other benefits of this feature may vary depending on system configuration. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. System and Maximum TDP is based on worst case scenarios. Skip To Main Content.

Safari Chrome Edge Firefox. Products Home Product Specifications Chipsets. Search examples You can search our catalog of processors, chipsets, kits, SSDs, server products and more in several ways. Add to Compare. Supplemental Information. Memory Specifications. Processor Graphics. Expansion Options. Package Specifications. Advanced Technologies. See detailed description to find out if you need this file. View download options. Version: A bus is a subsystem that transfers data between computer components or between computers.

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer nm , indicative of the size of features built on the semiconductor.

Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements. Overclocking indicates the ability to achieve high core, graphics and memory frequencies by independently raising processor clock speeds without impacting other system components. Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions.

See your Intel representative for details. DIMMs per Channel indicates the quantity of dual inline memory modules supported per each processor memory channel. Peripheral Component Interconnect Express or PCIe is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer.

The different PCI Express versions support different data rates. USB Universal Serial Bus is an industry standard connection technology for attaching peripheral devices to a computer. RAID Redundant Array of Independent Disks is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Visit www. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. It enables an environment where applications can run within their own space, protected from all other software on the system.

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